Welcome to MEDs Technologies
 


PCB Assembly

Capabilities

SMT & Through-hole
High Speed Placement
BGA and Micro-BGA Capabilities
CSP (Chip Scale Packaging)
Flip Chip
X-Ray Verification
Reballing
Rework (De-population and Re-population)
0402 Placement
Optimized Reflow Profiling
Turnkey or Consigned Kits
Press Fit Connectors
Quick-Turn Assemblies (Same Day & Next Day)
Prototype Quantities
Production Quantities w/Scheduled Deliveries
High Volume Production
Double-Sided SMT
De-ionized Wash
Rework Capabilities
De-population and Re-population
Fine Pitch
Cuts & Jumps
Piggybacks & Teepees
Minor PCB Repair
Same Day & Next Day Service
IPC-A-610 Class III Certified
Strict ESD Control
Mechanical Assembly and Box Builds
Work Closely w/In-House Design Team on DFM and DFT Issues
Cable & Harness Assembly
Functional Testing

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Assembly Quote

For fast & accurate quotation, please provide the following:

Assembly Quote Requirements

Number of components (In term of Discrete, passive IC & BGA)
Silkscreen
Bill of materials
Placement files
Stencils in Gerber format
Quantity required
Lead time expectation

To submit a request for a assembly quote, please email Gerald and provide as much information as you can. Hint: Print the assembly quote requirements and use it as a checklist.

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Source

Singapore
Indonesia

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