Design Consultancy

We conduct the research and development on specified front-end circuits and system for different wireless communication systems. This involves designing of passive RF components, active RF components, RF subsystems as well as components & systems in packing.

We also provide design, fabrication or both solutions in related technologies using MOSIS foundry, multilayer PCB and LTCC, etc.

We can be a partner with you or directly help you to set up the components and front-end subsystems for communication and radar systems covering frequency range from RF to millimeter-wave according to your requirement.

We provide following services worldwide

• Design related solutions
• Fabrication related solutions
• Test related solutions

In following areas

• RFIC Solutions
• IC Modeling
• Multilayer SIP Solutions
• MIC Solution
• Millimeter-wave Circuits and Systems
• Antenna and Array Antenna

Please email to sales@meds-tech.com or Contact Kaixue for further information.

Design related solutions:

Front-end System design (Communication and Radar):

1. System scheme according to application scenario, cost and Processes
2. Link budget calculation
3. Component specification distribution

Components design for RF, Microwave and Millimeter wave:

1. Standard products (link to product part)
2. Customerized products
1. Passive components including: Filter, Power Diver & Combiner, Coupler, Balun, Antenna, Bias-T circuit, etc.
2. Active components including: LNA, PA, Switch, Phase Shifter, Attenuator, Mixer, VCO, Multiplifier, PLL, etc.

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Fabrication related solutions:

PCB solution (link to PCB part)
IC solution (link to IC part)
RF-MEMS Fabrication (link to IC part)
LTCC fabrication
GMIC fabrication
Thin-film fabrication

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Test solutions:

1. Board level testament
2. On-Wafer measurement for IC Chip
3. Radiation Measurement for antenna and array antenna
4. RCS and frequency selection surface (FSS) measurement

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RFIC Design Solutions:

1. Design on CMOS: Silicon BJT and CMOS, SiGe HBT
2. Design on MMIC: GaAs MESFET, GaAs HBT, GaAs HEMT, and HFET
3. Design on GMIC
4. Design on RF-MEMS
5. Design for Low power, High linearity and Low noise designs using above processes
6. Design for vector Front-end system

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IC Modeling Solution

1. Passive Ccomponents and interconnects
2. Active device modeling and parameter extracting
3. Packaging parameter extracting and modeling

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Multilayer SIP Solution

1. Packaging in PCB (Novel Solution for High performance and Low Cost)
2. Packaging in LTCC
3. Packaging for SOCs
4. Packaging for MCM
5. Packaging for high data bit transmission systems
6. Packaging for high quality factor RF systems

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Microwave integrated circuit (MIC) Design Solution

1. Passive planar circuit designs including filter, balun, coupler, power divider, etc
2. Hybrid microwave integrated circuit design including mixer, LNA, PA, etc
3. Design for Vector Front-end system
4. Packaging design including wire bonding, mechanical shielding box, etc

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Millimeter-wave Circuits and System Design Solution

1. Customized Millimeter-wave system
2. Customized Millimeter-wave components
3. High performance, Low cost design and implementation

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Antenna and Array Antenna Design Solution

1. For commercial wireless communication system
2. For Radar Communication System
3. High performance, Low cost and compact size design and implementation

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